301369.SZ深圳证券交易所 · 创业板 ChiNext
PowerTECH 联动科技
Semiconductors 半导体
¥149.41−¥6.00 · −3.86%
Open 开盘
¥153.40
High 最高
¥155.36
Low 最低
¥141.24
Prev Close 昨收
¥155.41
Volume 成交量
619.8万股
Turnover 成交额
¥9.24亿
Mkt Cap 总市值
¥153亿
P/E 市盈率
341.1×
Recent Activity 近期动态All Filings 全部公告 →
12 significant filings since 29 May 2026: 8 on equity incentive, 1 on dividend and 1 on buyback, and 2 other kinds. The latest, on 17 Sep 2026: 2026年半年度权益分派实施公告. On 7 Jul 2026 the company said it expects net profit for the period ending 30 Jun 2026 to rise by 73.39% to 139.44% from the same period a year earlier.
自 29 May 2026 起有 12 份重大公告：equity incentive 8 份、dividend 1 份、buyback 1 份，另有 2 类。最新一份（17 Sep 2026）：2026年半年度权益分派实施公告。7 Jul 2026 公司预告截至 30 Jun 2026 的净利润较上年同期上升 73.39% 至 139.44%。
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Volume 成交量
619.8万
26 Aug02 Sep09 Sep17 Sep24 Sep
Overview 概览Deep Report 深度报告Financials 财务Valuation 估值Ownership 股东Analysts 券商Estimates 预测News 动态Events 事件Peers 同业
Top Holders 十大股东
As of 截至 30 Jun 2026 · Stake as % of total shares 总股本
31.05%
29.77%
2.66%
2.53%
2.49%
2.13%
1.08%
0.98%
0.77%
0.64%